[LCRC Accounts] Yearly Allocation Request from HEIGHTS-3D
Hello, A yearly allocation for the LCRC cluster has been requested with the following updated information: Submitter/PI: Tatyana Sizyuk Project Name: HEIGHTS-3D Division: NE Project title: HEIGHTS-3D modeling of plasma material interaction during edge-localized modes (ELM) and disruptions in fusion devices. Advanced 2D and 3D Laser-Produced Plasma Processes modeling for EUV Lithography and other advanced plasma applications. Associated funding: SEMATECH Other Systems: BG/P Science: HEIGHTS package is being developed as a comprehensive tool for simulation and optimization of various interaction processes during intense power deposition of various energy sources such as plasma, laser, and particle beams incident on target materials. This is multi-physics multi-phase package that combines state-of-the art models of energy deposition, vapor/plasma formation/evolution and magneto hydrodynamic (MHD) processes, thermal conduction in material and in plasma, atomic physics and resulting opacities, detailed photon radiation transport, and interaction between plasma/radiation and target material in full three dimension configurations. The package has many areas of applications. It is used to simulate the effect of plasma transient instabilities on plasma facing components in magnetic fusion reactors. This is a critical problem and a serious obstacle to the success of tokamak concept as a viable energy producing device. Most plasma instabilities will cause both surface and bulk damage to plasma-facing and structural materials. HEIGHTS is used to study self-consistently and benchmark various plasma interaction processes, to predict particle and heat intensity at chamber components surfaces, and to study the effects of plasma transient events and high power deposition on reactor walls and predicting/simulating components lifetime. Next area of research with HEIGHTS is optimization of sources for the advanced lithography that includes extreme ultraviolet (EUV) and beyond EUV (BEUV) lithography, which are perspective techniques in the development of the next generation computer chips. Numerical simulations will study various processes for photon production at 13.5 nm and 6.7 nm in efficient and optimized sources design that require detail atomic and plasma radiation physics. Project description: HEIGHTS package is being updated on continuing basis with frequent add-on of new modules, improving of developed physical models and mathematics, and revising of parallel computing methods. With the upgraded HEIGHTS, we will study the following state-of-the art multi-phase multi-physics engineering applications: 1. EUV and BEUV Lithography applications - the next generation lithography of 13.5 and 6-7 nm wavelength photons using 3D laser produced plasmas and multiple laser beams on targets. 2. Colliding plasmas physics for various applications 3. High-power transient plasma interactions with plasma facing and nearby components and calculation of erosion component lifetime in magnetic and inertial fusion applications We would like to request 300,000 allocation hours to conduct various optimizations, benchmarking, and parametric studies of the HEIGHTS 3D packages for several projects during FY2012. Project URL: Current FY Hours Used: undetermined amount New FY Requested allocation: 300000 Q1: 40000 Q2: 80000 Q3: 80000 Q4: 100000 Justification: Thank You, The LCRC Accounts System
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