As a follow-up to the previous email about the Microelectronics Co-Design FOA, below are the details about the Q&A session scheduled for this Friday, April 2nd, 9-11am.

 

Thanks,

Valerie

 

From: Eichberger, Laurie L. <eichberger@anl.gov>
Date: Wednesday, March 31, 2021 at 1:23 PM
Subject: REMINDER: SC FOA on Microelectronics Co-Design Research question & answer session, Friday, April 2nd, 9 - 11 AM

Good afternoon,

I'm following up my zoom email invite with the detailed information (see below) Amanda sent you on Friday, March 26th pertaining to the SC FOA on Microelectronics Co-Design Research.  

 

Here is the zoom information for the Q&A session scheduled for this Friday, April 2nd, 9:00 - 11:00 AM CT.  Please forward the zoom information to anyone in your division that will be joining this question-and-answer session.

 

Join ZoomGov Meeting

https://argonne.zoomgov.com/j/1601886403

 

Meeting ID: 160 188 6403

One tap mobile

+16692545252,,1601886403# US (San Jose)

+16468287666,,1601886403# US (New York)

 

Dial by your location

        +1 669 254 5252 US (San Jose)

        +1 646 828 7666 US (New York)

        +1 669 216 1590 US (San Jose)

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Meeting ID: 160 188 6403

Find your local number: https://argonne.zoomgov.com/u/accI1C0Hie

 

 

Best Regards,

Laurie Eichberger

 

Laurie L. Eichberger
Executive Assistant to Amanda Petford-Long, Director
Materials Science Division
Argonne National Laboratory
9700 S. Cass Avenue
Lemont, IL 60439

630-252-7570 (phone)

 

 

 

From: "Amanda K. Petford-Long" <petford.long@anl.gov>
Date: Friday, March 26, 2021 at 12:51
Subject: Re: SC FOA on Microelectronics Co-Design Research

 

***Please share with all those in your division who might be interested in applying***

  

Dear Colleagues:

 

There is a new FOA from the Office of Science on Microelectronics Co-Design Research (attached here). We are limited to two letters of intent (LOIs) (and therefore also 2 proposals) as lead from Argonne as part of this call and thus there will be an internal down-selection process.  LOIs are due to DOE on April 21, 2021 with full proposals due May 19, 2021. The FOA is attached.

 

Because of the breadth of the FOA, which includes ASCR, BES, FES, HEP and NP, we expect teams to self-assemble from across Argonne. To assist in this, we are asking those interested in participating to prepare one slide using the attached template.

  • The slide should be sent to Laurie Eichberger (eichberger@anl.gov) as soon as possible. Laurie will upload into a Box folder that everyone will be able to view.
  • The slide should include PI name, topic of interest, expertise, what partners are being sought.
  • Slide filename should include PI name and brief topic, and the email to Laurie should indicate which of the three research areas outlined below is most appropriate (we will have Box folders for each)
  • The link to the Box folder is: https://anl.box.com/s/87wiizpo7mrkyaeqec8jvx53uhycpgiz
    • Staff will be able to view and download, but not upload directly

 

Next Friday, April 2, 9-11 am, there will be a Q&A session on Zoom (link to follow) with Argonne’s microelectronics working group plus all of the relevant PoCs

 

Due Dates:

 

Monday April 12, 11:59 Central time (late LOIs will not be accepted): LOIs due to Laurie Eichberger (eichberger@anl.gov). Please put Microelectronics Co-Design Research LOI as the subject line.  LOIs must conform to call requirements (except the Lab Director signature on the cover page). 

 

Wednesday April 14, COB: Notification to PIs about which LOIs will move forward, after review by a selection committee.

  • Selection Committee: Co-Chairs – Stephen Streiffer, Amanda Petford-Long and CELS representative. All relevant PoCs will serve on selection committee

 

Wednesday April 21, noon: Selected LOIs due to Diane Hart, including cover pages with Lab Director signature.

 

Some other info from the FOAplease read the entire FOA carefully and be sure to comply with all requirements:

 

SC is poised at the convergence of these diverse research areas, in a unique position to play a critical role in the advancement of microelectronic technologies over the coming decades, and also to benefit from the resultant capabilities for advancing fundamental scientific research. To support and foster this paradigm shift, this funding opportunity is requesting proposals for fundamental scientific research in the following three Research Areas

New materials, chemistry, synthesis, and fabrication 

New computing paradigms and architectures 

Integrated sensing, edge computing, and communication 

 

Each Letter of Intent and Proposal in response to this funding opportunity must propose research that is integrated across at least two of these areas

 

More details about these areas are available in the FOA.

 

The LOI may not exceed two pages (excluding cover page and required Tables), when printed using standard letter-size (8.5 x 11-inch) paper with 1-inch margins (top, bottom, left, and right). The font must not be smaller than 11 point. Figures and references, if included, must fit within the two-page limit. You should also include reference to appropriate SC reports.

 

After the description of the proposed research, include the required Tables (see p. 13 of the FOA).  If you have questions, please feel free to reach out.

 

Applicant institutions are limited to no more than two (2) pre-applications or applications as either a single-institution applicant or as the lead of a multi-institutional team. There is no limit on the number of pre-applications on which an institution may appear as a partner (not the lead institution)

 

Stephen, Amanda and Valerie

 

 

Dr Amanda K Petford-Long  (she/hers)

Division Director, Materials Science Division

Argonne Distinguished Fellow

 

Materials Science Division, 241-A356

Argonne National Laboratory,

9700 S Cass Avenue, Argonne, IL 60439, USA

 

Tel: 630 252 5480

Fax: 630 252 6866

 

Professor, Dept of Materials Science and Engineering, Northwestern University

Fellow, American Physical Society and Royal Academy of Engineering